Recently, the Working Group of International Electro-technical Commission on Fiber Optical Active Devices (IEC/SC 86C WG4) held a working conference in San Francisco, United States, during which the standard—"Optical Fiber Active Components and Devices – Standards for Packaging and Interface Part 22: 25Gb/s Direct-modulated Laser Packaging with Temperature Control Unit," developed by Accelink in collaboration with China Electronics Standardization Institute, was formally approved and published by IEC. This standard specifies the packaging requirements for 25 Gb/s DML lasers, which are utilized extensively in 5G, data center, and WDM transmission network equipment.
There are three main international standardization bodies: IEC, ISO, and the International Telecommunications Union (ITU). Accelink has been at the forefront of a number of initiatives related to the standard since it was approved by the IEC in 2021, including the application for approval, the drafting of the standard, the solicitation of opinions for compilation, discussions with international experts, and discussions at IEC conferences. Accelink has actively contributed with Accelink's wisdom and solutions throughout the three-year promotion process, and has taken the lead in all follow-ups connected to the finalization of the standard's content submitted to the IEC office for evaluation and the release of the standard.
